Shenzhen Xinhuo Future Technology Co., Ltd offers a full range of rigid board constructions from single/double sided upwards, but it also support laser drilled microvias, cavity boards, heavy copper up to 30 oz., via-in-pad, microwave & RF boards, up to 58 layers and more other technologies.

• High layer count multilayer rigid
• Thermal and signal integrity management solutions, employing coins and cavities
• FR4 / Polyimide / High Speed / Special Materials
• Hybrid solutions for Microwave/RF applications
• HDI Micro via– blind, buried, staggered & stacked vias
• Microvias filled by epoxy and copper capped
• Quick turn support
• Thermal management
• Heavy copper
• Controlled Impedance
• Large format PCB

Shenzhen Xinhuo Future Technology Co., Ltd offer rigid-flexible and flexible PCBs and HDIs for high-reliability applications, with features down to 25 µm and flexible dielectric core down to 25 µm. With the revolution in portable communications products over the last decade, Rigid Flexible Circuits have become a preferred design solution for complex, three-dimensional product assembly, and advanced component surface mounting demands.

• Double/single sided flexible
• Multilayer flexible
• Multilayer rigid-flexible
• Mixed dielectric (hybrid) constructions
• Quick turn rigid-flexible
• HDI Micro via– blind, buried, staggered & stacked vias
• Microvias filled by epoxy and copper capped
• Sequential build up
• High speed requirements
• Large format Circuit

Shenzhen Xinhuo Future Technology Co., Ltd offer rigid-flexible and flexible PCBs and HDIs for high-reliability applications, with features down to 25 µm and flexible dielectric core down to 25 µm. With the revolution in portable communications products over the last decade, Rigid Flexible Circuits have become a preferred design solution for complex, three-dimensional product assembly, and advanced component surface mounting demands.

• Double/single sided flexible
• Multilayer flexible
• Multilayer rigid-flexible
• Mixed dielectric (hybrid) constructions
• Quick turn rigid-flexible
• HDI Micro via– blind, buried, staggered & stacked vias
• Microvias filled by epoxy and copper capped
• Sequential build up
• High speed requirements
• Large format Circuit

Shenzhen Xinhuo Future Technology Co., Ltd is a one-stop shop for all your PCB assembly needs. We provide in-house fabrication, assembly and turnkey services within five days. We specialize in fast turn time prototype and short run PCB Assembly. We use state-of-the-art equipment to produce reliable assembled PCBs.

• Electronic components cost online quote
• Flex, rigid flex, and rigid PCB cost online quote
• PCB Assembly cost online quote
• Flex, rigid flex, and rigid PCB Assembly
• SMT, through-hole, and mixed technology
• Board sizes up to 20" x 24"
• Complex, high density assemblies
• PBGA, CBGA, TBGA, FPGA, CGA, LGA
• Package on Package (PoP) assembly
• Micro BGA (0.4mm)
• 0402s, 0201s, 01005s
• Wave and selective solder